| PART |
Description |
Maker |
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
| M3H71FAD-R M3H15TDD M3H52TCD-R MH75FBD MH75FAG MH7 |
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
16-bit, 75 MIPS, 2.5v, 2 serial ports, host port, 80 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 20KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 75 MIPS, 2.5V, 2 Serial Ports, Host Port, 40 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: BGA THERM ENH W/ HEATSINK; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 484 ball BGA; No of Pins: 484; Temperature Range: Ind
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
|
MTRONPTI
|
| EUA2011HIR1 EUA2011JIR1 |
FAN,115VAC,78CFM,120X120X38 DUAL BALL,TERMINAL,UL/CE/CUL 3单声道无滤波器D类音频功率放大器
FAN,220VAC,110CFM,120X120X38 BALL,TERMINAL,UL/CE/TUV/CUL 3单声道无滤波器D类音频功率放大器
FAN,12VDC,9.27CFM,51X51X10,.8W BALL,10.5"LEADS,UL/CUL/TUV/CE
|
Eutech Microelectronics, Inc.
寰蜂俊绉???′唤??????
|
| PGM08XXX-XX PGM12XXX-XX |
IC Socket / Pin Grid Array
|
Aries Electronics
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| 094240-3818 0942403818 |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole, PBT, Vertical, 18 Circuit, Gray
|
Molex Electronics Ltd.
|
| CA-PLCC44-D-M-T-01 |
Carrier Adaptor (CA): 44 position PLCC production socket with test points to mini-grid array interface.
|
Ironwood Electronics.
|
| V54C3256164VBUC V54C3256164VBUT V54C3256164VBLT7PC |
256Mbit (16M x 16) SDRAM, LVTTL, low power, 8ns
LOW POWER 256Mbit SDRAM 3.3 VOLT, 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
256Mbit (16M x 16) SDRAM, LVTTL, low power, 7ns
|
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
|
